PCA Endowed Scholarship

Mr. Mark KowlzanPCA Packaging Corporation of America

Demonstrating his commitment to the future of the paper industry, Mark Kowlzan, CEO of Packaging Corporation of America (PCA), announced his intention to donate $1,000,000 to supplement the existing PCA Endowed Scholarship at the April 9, 2019 Annual Meeting of the Paper Science & Engineering Foundation (PSEF). This level of endowment funds three scholarships valued at full in-state tuition each academic year. The recipients are selected by an application and interview process from the eligible pool of juniors and seniors in the Paper Engineering minor based on academic achievement, demonstrated commitment to the paper industry through work experiences, and leadership potential.

Headquartered in Lake Forest, IL, PCA offers packaging solutions by incorporating innovative processes and products and has eight mills and 94 box plants across the United States. One of the largest producers of containerboard and corrugated packaging in the US, PCA is the third largest producer of uncoated freesheet in North America and has approximately 15,000 employees. PCA (and its predecessor entities) has been a member company of the PSEF since 1979.

2019-2020 Scholarship Recipients

Photo of Delaney Brown

Delaney Brown

Photo of Hayden Hoogerhyde

Hayden Hoogerhyde

Photo of Kate Witzgall

Kate Witzgall